The initiatives will focus on:
- 1. Next-generation 3D integrated circuits based on CFET
- 2. Architecture advanced materials for high-mobility transistors
- 3. Semiconductor materials for integrated sensors and renewable energy applications
- 4. Secure AI system-on-chip (SoC) design built on RISC-V architecture
- 5. Materials and devices for power electronics using wide bandgap semiconductors.
Semiconductor chips developed by Vietnamese universities were showcased at the SEMIExpo semiconductor exhibition held in Ha Noi in November 2025.
The cooperation is implemented under the NEXUS programme, Japan’s strategic science and technology initiative with ASEAN, led by the Japan Science and Technology Agency, with an estimated budget of USD 100 million for the 2024–2029 period.
Building on these initial projects, both sides agreed to further scale up collaboration, with a target of co-funding 10 additional joint research projects in 2026, focusing on four priority areas: semiconductor materials, design, enabling technologies, and manufacturing.
